Semiconductor packages including a bonding wire branch structure

ABSTRACT

A semiconductor package includes a package substrate, a die stack having a first sub-stack part and a second sub-stack part, an interface chip, and a bonding wire structure. The bonding wire structure includes a first signal wire connecting first signal die pads included in the first sub-stack part to each other, a first signal extension wire connecting the first signal wire to the interface chip, a second signal wire connecting second signal die pads included in the first sub-stack part to each other, a second signal extension wire connecting the second signal wire to the interface chip, an interpose wire connecting interpose die pads included in the first and second sub-stack parts to each other and electrically connecting the interpose die pads to the interface chip, and a shielding wire branched from the interpose wire.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority under 35 U.S.C. 119(a) to KoreanApplication No. 10-2020-0003928, filed on Jan. 10, 2020, which isincorporated herein by references in its entirety.

BACKGROUND 1. Technical Field

Embodiments of the present disclosure relate to semiconductor packagetechnologies and, more particularly, to semiconductor packages includinga bonding wire branch structure.

2. Related Art

Semiconductor packages having a large capacity and a high density areincreasingly in demand with the development of high performanceelectronic systems. A lot of effort has been focused on embedding aplurality of semiconductor dies in one semiconductor package. That is,highly integrated semiconductor packages may be realized by increasingthe number of semiconductor dies vertically stacked in eachsemiconductor package. Bonding wires are widely used to electricallyconnect the stacked semiconductor dies to each other or to electricallyconnect the stacked semiconductor dies to a package substrate. As thenumber of semiconductor dies vertically stacked in each semiconductorpackage increases, a length of the bonding wires may also becomeincreased. Increasing the length of the bonding wires may lead todegradation of electrical characteristics of data signals transmittedthrough the bonding wires.

SUMMARY

According to an embodiment, a semiconductor package may include apackage substrate, a die stack, and an interface chip. The die stack mayinclude a first sub-stack part stacked on the package substrate and asecond sub-stack part disposed between the first sub-stack part and thepackage substrate. Each of the first and second sub-stack parts mayinclude a plurality of semiconductor dies, and each of the plurality ofsemiconductor dies may include a first signal die pad, an interpose diepad, and a second signal die pad. The interface chip is disposed on thepackage substrate to be spaced apart from the die stack. The firstsignal die pads included in the first sub-stack part are connected toeach other by a first signal wire. A first signal extension wire extendsfrom the first signal wire to connect the first signal wire to theinterface chip. The second signal die pads included in the firstsub-stack part are connected to each other by a second signal wire. Asecond signal extension wire extends from the second signal wire toconnect the second signal wire to the interface chip. An interpose wireconnects the interpose die pads included in the first and secondsub-stack parts to each other and extends to electrically connects theinterpose die pads included in the first and second sub-stack parts tothe interface chip. A shielding wire is branched from the interpose wireand is located between the first and second signal extension wires.

According to another embodiment, a semiconductor package may include apackage substrate, a die stack, and an interface chip. The die stack isconfigured to include a first sub-stack part stacked on the packagesubstrate and a second sub-stack part disposed between the firstsub-stack part and the package substrate. Each of the first and secondsub-stack parts may include a plurality of semiconductor dies, and eachof the plurality of semiconductor dies may include a first signal diepad, an interpose die pad, and a second signal die pad. The interfacechip is disposed on the package substrate to be spaced apart from thedie stack and is configured to include a first column of chip pads and asecond column of chip pads. The first column of chip pads may include afirst signal chip pad, a shielding chip pad, and a second signal chippad, and the second column of chip pads may include a third signal chippad, an interpose chip pad, and a fourth signal chip pad. The firstsignal die pads included in the first sub-stack part are connected toeach other by a first signal wire. A first signal extension wire extendsfrom the first signal wire to connect the first signal wire to the firstsignal chip pad. The second signal die pads included in the firstsub-stack part are connected to each other by a second signal wire. Asecond signal extension wire extends from the second signal wire toconnect the second signal wire to the second signal chip pad. Theinterpose die pads included in the first and second sub-stack parts areconnected to each other by an interpose wire, and the interpose wireelectrically connects the interpose die pads included in the first andsecond sub-stack parts to the interpose chip pad. The first signal diepads included in the second sub-stack part are connected to each otherby a third signal wire, and the third signal wire extends toelectrically connect the first signal die pads included in the secondsub-stack part to the third signal chip pad. The second signal die padsincluded in the second sub-stack part are connected to each other by afourth signal wire, and the fourth signal wire extends to electricallyconnect the second signal die pads included in the second sub-stack partto the fourth signal chip pad. A shielding wire is branched from theinterpose wire and is located between the first and second signalextension wires.

According to yet another embodiment, a semiconductor package may includea package substrate, a die stack, and an interface chip. The die stackis configured to include semiconductor dies stacked on the packagesubstrate. Each of the semiconductor dies may include a die pad. Theinterface chip is disposed on the package substrate to be spaced apartfrom the die stack and is configured to include a first chip pad and asecond chip pad. The die pads of the semiconductor dies are connected toeach other by a first bonding wire, and the first bonding wire extendsto electrically connect the die pads to the first chip pad of theinterface chip. A second bonding wire is branched from the first bondingwire and is connected to the second chip pad of the interface chip. Thefirst bonding wire may include a first sub-wire and a second sub-wire.The first sub-wire may include a first ball portion which is bonded tothe die pad located at a position where the second bonding wire isbranched from the first bonding wire. The second sub-wire may include astitch portion which is vertically bonded onto the first ball portion.The second bonding wire may include a second ball portion verticallybonded onto the stitch portion.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are a plan view and a cross-sectional view illustrating asemiconductor package according to an embodiment, respectively.

FIG. 3 is a plan view illustrating a bonding wire structure of thesemiconductor package shown in FIG. 1.

FIG. 4 is a cross-sectional view taken along an extension direction ofsignal extension wires shown in FIG. 3.

FIG. 5 is a cross-sectional view taken along an extension direction ofshielding wires shown in FIG. 3.

FIG. 6 is a plan view illustrating shielding wires of FIG. 3.

FIG. 7 is a cross-sectional view illustrating a bonded structure ofwires at a branch position ‘A’ of FIG. 3.

FIG. 8 is a cross-sectional view illustrating a semiconductor packageaccording to another embodiment.

FIG. 9 is a cross-sectional view illustrating a semiconductor packageaccording to yet another embodiment.

FIG. 10 is a block diagram illustrating an electronic system employing amemory card including at least one of semiconductor packages accordingto the embodiments.

FIG. 11 is a block diagram illustrating another electronic systemincluding at least one of semiconductor packages according to theembodiments.

DETAILED DESCRIPTION

The terms used herein may correspond to words selected in considerationof their functions in the embodiments, and the meanings of the terms maybe construed to be different according to ordinary skill in the art towhich the embodiments belong. If defined in detail, the terms may beconstrued according to the definitions. Unless otherwise defined, theterms (including technical and scientific terms) used herein have thesame meaning as commonly understood by one of ordinary skill in the artto which the embodiments belong.

It will be understood that although the terms “first,” “second,” “third”etc. may be used herein to describe various elements, these elementsshould not be limited by these terms. These terms are only used todistinguish one element from another element, but not used to defineonly the element itself or to mean a particular sequence.

It will also be understood that when an element or layer is referred toas being “on,” “over,” “below,” “under,” or “outside” another element orlayer, the element or layer may be in direct contact with the otherelement or layer, or intervening elements or layers may be present.Other words used to describe the relationship between elements or layersshould be interpreted in a like fashion (e.g., “between” versus“directly between” or “adjacent” versus “directly adjacent”).

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” “top,” “bottom” and the like, may be used to describe anelement and/or feature's relationship to another element(s) and/orfeature(s) as, for example, illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use and/or operation in additionto the orientation depicted in the figures. For example, when the devicein the figures is turned over, elements described as below and/orbeneath other elements or features would then be oriented above theother elements or features. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

A semiconductor package may include electronic devices such assemiconductor chips or semiconductor dies. The semiconductor chips orthe semiconductor dies may be obtained by separating a semiconductorsubstrate such as a wafer into a plurality of pieces using a die sawingprocess. The semiconductor chips may correspond to memory chips, logicchips, or application specific integrated circuits (ASIC) chips. Thememory chips may include dynamic random access memory (DRAM) circuits,static random access memory (SRAM) circuits, NAND-type flash memorycircuits, NOR-type flash memory circuits, magnetic random access memory(MRAM) circuits, resistive random access memory (ReRAM) circuits,ferroelectric random access memory (FeRAM) circuits or phase changerandom access memory (PcRAM) circuits which are integrated on thesemiconductor substrate. The semiconductor package may be employed incommunication systems such as mobile phones, electronic systemsassociated with biotechnology or health care, or wearable electronicsystems. The semiconductor packages may be applicable to internet ofthings (IoT).

Same reference numerals refer to same elements throughout thespecification. Even though a reference numeral is not mentioned ordescribed with reference to a drawing, the reference numeral may bementioned or described with reference to another drawing. In addition,even though a reference numeral is not shown in a drawing, it may bementioned or described with reference to another drawing.

FIGS. 1 and 2 are a plan view and a cross-sectional view illustrating asemiconductor package 10 according to an embodiment, respectively.

Referring to FIGS. 1 and 2, the semiconductor package 10 may beconfigured to include a package substrate 100, a die stack 200S, and aninterface chip 300. The package substrate 100 may be provided as a basemember on which semiconductor dies 200 and the interface chip 300 aredisposed. The package substrate 100 may be configured to includemultiple layers of metallization and a plurality of dielectric layers.The package substrate 100 may be provided as a connection member forelectrically connecting the semiconductor package 10 to an electronicsystem. The package substrate 100 may be realized using a printedcircuit board (PCB).

The plurality of semiconductor dies 200 may be sequentially stacked onthe package substrate 100 to constitute the die stack 200S. The diestack 200S may include a first sub-stack part 200U corresponding to anupper portion of the die stack 200S and a second sub-stack part 200Lcorresponding to a lower portion of the die stack 200S. For example,when the number of the semiconductor dies 200 constituting the die stack200S is ‘8’, four of the semiconductor dies 200 may constitute the firstsub-stack part 200U and the other four dies of the semiconductor dies200 may constitute the second sub-stack part 200L disposed under thefirst sub-stack part 200U.

The semiconductor dies 200 may have substantially the same configurationand function. Each of the semiconductor dies 200 may be a die includingintegrated circuits which are realized on a silicon substrate. Each ofthe semiconductor dies 200 may be a memory die, for example, a flashmemory die.

The semiconductor dies 200 may be sequentially stacked to be offset inone direction to provide a step structure. Each of the semiconductordies 200 may include a plurality of die pads 210 acting as connectionterminals. The semiconductor dies 200 may be stacked to be laterallyoffset such that the die pads 210 of the semiconductor dies 200 arerevealed. Bonding wires may be bonded to the revealed die pads 210.

In each of the semiconductor dies 200, the die pads 210 may include afirst signal die pad 211, a first interpose die pad 212, a second signaldie pad 213, a second interpose die pad 214, and a third signal die pad215. The first signal die pad 211, the second signal die pad 213, andthe third signal die pad 215 may be provided as signal terminals throughwhich data signals are transmitted.

In an embodiment, the first interpose die pad 212 and the secondinterpose die pad 214 may be provided as power terminals for applying apower supply voltage to the semiconductor die 200. In anotherembodiment, the first interpose die pad 212 and the second interpose diepad 214 may be provided as ground terminals for supplying a groundvoltage to the semiconductor die 200. Alternatively, the first interposedie pad 212 may be provided as a power terminal for applying a powersupply voltage to the semiconductor die 200, and the second interposedie pad 214 may be provided as a ground terminal for supplying a groundvoltage to the semiconductor die 200.

In each of the semiconductor dies 200, the die pads 210 may besequentially arrayed in one column. In each of the semiconductor dies200, the first signal die pad 211, the first interpose die pad 212, thesecond signal die pad 213, the second interpose die pad 214, and thethird signal die pad 215 may be sequentially arrayed in one column. Thefirst interpose die pad 212 may be disposed between the first signal diepad 211 and the second signal die pad 213. The second interpose die pad214 may be disposed between the second signal die pad 213 and the thirdsignal die pad 215.

The die pads 210 of the semiconductor dies 200 may be arrayed in aplurality of rows which are parallel with a direction in which thesemiconductor dies 200 are offset when viewed from a plan view. Forexample, the first signal die pads 211 of the plurality of semiconductordies 200 may be arrayed in a row in a plan view. Similarly, the firstinterpose die pads 212 of the plurality of semiconductor dies 200 mayalso be arrayed in a row in a plan view.

Referring again to FIGS. 1 and 2, the interface chip 300 may be disposedon the package substrate 100 to be laterally spaced apart from the diestack 200S. The interface chip 300 may include chip pads 310, 320, and330 disposed on a top surface 300T thereof. The interface chip 300 mayhave a first edge 301 and a second edge 302, the top surface 300T may beset as a surface between the first edge 301 and the second edge 302. Adistance between the first edge 301 and the die stack 200S may be lessthan a distance between the second edge 302 and the die stack 200S. Thefirst edge 301 may face the die stack 200S, and the second edge 302 maybe an edge of the interface chip 300 opposite to the die stack 200S.

The chip pads 310 may be arrayed in a first column on the top surface300T of the interface chip 300, the chip pads 320 may be arrayed in asecond column on the top surface 300T of the interface chip 300, and thechip pads 330 may be arrayed in a third column on the top surface 300Tof the interface chip 300. The chip pads 310 arrayed in the first columnmay be disposed between the first edge 301 and the second edge 302. Thechip pads 320 arrayed in the second column may be disposed between thefirst edge 301 and the first column in which the chip pads 310 arearrayed. The chip pads 330 arrayed in the third column may be disposedbetween the second edge 302 and the first column in which the chip pads310 are arrayed. A distance between the first edge 301 and the secondcolumn in which the chip pads 320 are arrayed may be less than adistance between the first edge 301 and the first column in which thechip pads 310 are arrayed, and the chip pads 320 may be arrayed in adirection which is parallel with an extension direction of the firstedge 301. A distance between the second edge 302 and the third column inwhich the chip pads 330 are arrayed may be less than a distance betweenthe second edge 302 and the first column in which the chip pads 310 arearrayed, and the chip pads 330 may be arrayed in a direction which isparallel with an extension direction of the second edge 302.

The chip pads 310 arrayed in the first column may include a first signalchip pad 311, a first shielding chip pad 312, a second signal chip pad313, a second shielding chip pad 314, and a fifth signal chip pad 315which are sequentially arrayed in the first column. The first shieldingchip pad 312 may be disposed between the first signal chip pad 311 andthe second signal chip pad 313. The first signal chip pad 311 may beprovided as a chip pad corresponding to the first signal die pads 211 ofthe semiconductor dies 200 included in the first sub-stack part 200U,and the first shielding chip pad 312 may be provided as a chip padcorresponding to the first interpose die pads 212 of the semiconductordies 200 included in the first sub-stack part 200U. The second signalchip pad 313 may be provided as a chip pad corresponding to the secondsignal die pads 213 of the semiconductor dies 200 included in the firstsub-stack part 200U, and the fifth signal chip pad 315 may be providedas a chip pad corresponding to the third signal die pads 215 of thesemiconductor dies 200 included in the first sub-stack part 200U.

The chip pads 320 arrayed in the second column may include a thirdsignal chip pad 321, a first interpose chip pad 322, a fourth signalchip pad 323, a second interpose chip pad 324, and a sixth signal chippad 325 which are sequentially arrayed in the second column. The firstinterpose chip pad 322 may be disposed between the third signal chip pad321 and the fourth signal chip pad 323. The third signal chip pad 321may be provided as a chip pad corresponding to the first signal die pads211 of the semiconductor dies 200 included in the second sub-stack part200L, and the first interpose chip pad 322 may be provided as a chip padcorresponding to the first interpose die pads 212 of the semiconductordies 200. The fourth signal chip pad 323 may be provided as a chip padcorresponding to the second signal die pads 213 of the semiconductordies 200 included in the second sub-stack part 200L, and the sixthsignal chip pad 325 may be provided as a chip pad corresponding to thethird signal die pads 215 of the semiconductor dies 200 included in thesecond sub-stack part 200L. The second interpose chip pad 324 may bedisposed between the fourth signal chip pad 323 and the sixth signalchip pad 325. The second interpose chip pad 324 may be provided as achip pad corresponding to the second interpose die pads 214 of thesemiconductor dies 200.

Referring still to FIGS. 1 and 2, the package substrate 100 may includefirst bond fingers 110 disposed between the die stack 200S and theinterface chip 300. The first bond fingers 110 may be disposed tocorrespond to the die pads 210 of the semiconductor dies 200. A signalbond finger 111 of the first bond fingers 110 may be disposed tocorrespond to the first signal die pads 211 of the semiconductor dies200, and an interpose bond finger 112 of the first bond fingers 110 maybe disposed to be spaced apart from the signal bond finger 111. Thepackage substrate 100 may further include second bond fingers 120 thatare disposed to be adjacent to the second edge 302 of the interface chip300. The interface chip 300 may be disposed between a column in whichthe first bond fingers 110 are arrayed and a column in which the secondbond fingers 120 are arrayed.

FIG. 3 is a plan view illustrating a bonding wire structure of thesemiconductor package 10 shown in FIG. 1. FIG. 4 is a cross-sectionalview taken along an extension direction of a first signal extension wire410E of the bonding wire structure shown in FIG. 3. FIG. 5 is across-sectional view taken along an extension direction of a firstshielding wire 430E of the bonding wire structure shown in FIG. 3.

Referring to FIG. 3, the semiconductor package 10 may include a bondingwire structure for connecting the die stack 200S to the interface chip300 and for connecting the interface chip 300 to the package substrate100. The bonding wire structure may include a first signal wire 410, afirst signal extension wire 410E, a second signal wire 420, a secondsignal extension wire 420E, a first interpose wire 430, a secondinterpose wire 450, the first shielding wire 430E, and a secondshielding wire 450E. The bonding wire structure may further include athird signal wire 410-1, a fourth signal wire 420-1, a fifth signal wire440, a fifth signal extension wire 440E, a sixth signal wire 440-1, andchip boding wires 460. This bonding wire structure may be formed using awire bonding process.

Referring to FIGS. 3 and 4, the first signal wire 410 may be formed toconnect the first signal die pads 211 included in the first sub-stackpart 200U to each other. The first signal wire 410 may be formed toconnect only the semiconductor dies 200 included in the first sub-stackpart 200U to each other. The first signal wire 410 may be electricallydisconnected from the semiconductor dies 200 included in the secondsub-stack part 200L.

The first signal extension wire 410E may be formed to connect the firstsignal wire 410 to the interface chip 300. The first signal extensionwire 410E may be formed to extend from the first signal wire 410 and maybe bonded to the first signal chip pad 311 of the interface chip 300.The first signal extension wire 410E may be disconnected from thepackage substrate 100 and may extend to be spaced apart from the packagesubstrate 100. The first signal extension wire 410E may extend to bedirectly connected to the interface chip 300 without being connected tothe package substrate 100.

The third signal wire 410-1 may be formed to connect the first signaldie pads 211 included in the second sub-stack part 200L to each otherand may extend to electrically connect the first signal die pads 211included in the second sub-stack part 200L to the third signal chip pad321 of the interface chip 300. The third signal wire 410-1 may be bondedto the signal bond finger 111 and may further extend to connect thesignal bond finger 111 to the interface chip 300. The third signal wire410-1 may be connected to the interface chip 300 through the signal bondfinger 111 of the package substrate 100.

The third signal wire 410-1 may be disconnected from the semiconductordies 200 included in the first sub-stack part 200U and may connect onlythe semiconductor dies 200 included in the second sub-stack part 200L tothe interface chip 300. The first signal wire 410 and the first signalextension wire 410E may be disconnected from the semiconductor dies 200included in the first sub-stack part 200U and may electrically connectonly the semiconductor dies 200 included in the first sub-stack part200U to the first signal chip pad 311 of the interface chip 300. Thethird signal wire 410-1 may provide a second signal path that isindependent and distinct from a first signal path comprised of the firstsignal wire 410 and the first signal extension wire 410E.

Through the first and second signal paths which are independent fromeach other, the first sub-stack part 200U and the second sub-stack part200L may independently communicate with the interface chip 300. Theinterface chip 300 may individually control the first sub-stack part200U and the second sub-stack part 200L through the first and secondsignal paths. The interface chip 300 may control the first sub-stackpart 200U and the second sub-stack part 200L separately withoutsimultaneously controlling all of the eight semiconductor dies 200included in the die stack 200S. Thus, a first group of the semiconductordies 200 included in the first sub-stack part 200U and a second group ofthe semiconductor dies 200 included in the second sub-stack part 200Lmay independently operate to improve an operation speed of thesemiconductor package 10. The interface chip 300 may be a control chipfor controlling the semiconductor dies 200 included in the die stack200S or a buffer chip for buffering operations of the semiconductor dies200 included in the die stack 200S.

Referring again FIG. 3, the second signal wire 420 may be formed toconnect the second signal die pads 213 included in the first sub-stackpart 200U to each other. The second signal wire 420 may be formed toconnect only the semiconductor dies 200 included in the first sub-stackpart 200U to each other.

The second signal extension wire 420E may be formed to connect thesecond signal wire 420 to the interface chip 300. The second signalextension wire 420E may be formed to extend from the second signal wire420 and may be bonded to the second signal chip pad 313 of the interfacechip 300. The second signal extension wire 420E may be disconnected fromthe package substrate 100 and may extend to be spaced apart from thepackage substrate 100. The second signal extension wire 420E may extendto be directly connected to the interface chip 300 without beingconnected to the package substrate 100.

The fourth signal wire 420-1 may be formed to connect the second signaldie pads 213 included in the second sub-stack part 200L to each otherand may extend to electrically connect the second signal die pads 213included in the second sub-stack part 200L to the fourth signal chip pad323 of the interface chip 300. The fourth signal wire 420-1 may bebonded to one of the first bond fingers 110 and may further extend toconnect the one of the first bond fingers 110 to the interface chip 300.The fourth signal wire 420-1 may be connected to the interface chip 300through one of the first bond fingers 110 of the package substrate 100.

Referring again to FIG. 3, the fifth signal wire 440 may be formed toconnect the third signal die pads 215 included in the first sub-stackpart 200U to each other. The fifth signal extension wire 440E may beformed to extend from the fifth signal wire 440 and may be bonded to thefifth signal chip pad 315 of the interface chip 300. The fifth signalextension wire 440E may extend to be parallel with the first and secondsignal extension wires 410E and 420E. The sixth signal wire 440-1 may beformed to connect the third signal die pads 215 included in the secondsub-stack part 200L to each other and may extend to electrically connectthe third signal die pads 215 included in the second sub-stack part 200Lto the sixth signal chip pad 325 of the interface chip 300.

Referring to FIGS. 3 and 5, the first interpose wire 430 may connect thefirst interpose die pads 212 included in the first and second sub-stackparts 200U and 200L to each other and may further extend to electricallyconnect the first interpose die pads 212 included in the first andsecond sub-stack parts 200U and 200L to the first interpose chip pad 322of the interface chip 300. The first interpose wire 430 may be bonded tothe interpose bond finger 112 of the package substrate 100 and mayfurther extend to connect the interpose bond finger 112 to the firstinterpose chip pad 322 of the interface chip 300. The first interposewire 430 may be connected to the interface chip 300 through one of theinterpose bond finger 112 of the package substrate 100.

The first interpose wire 430 may be used as a power supply wire forsupplying a power supply voltage to the semiconductor dies 200 includedin the first and second sub-stack parts 200U and 200L. Alternatively,the first interpose wire 430 may be used as a ground wire for supplyinga ground voltage to the semiconductor dies 200 included in the first andsecond sub-stack parts 200U and 200L.

The first shielding wire 430E may be branched from the first interposewire 430 at the branch position ‘A’. The first shielding wire 430E maybe branched from the first interpose wire 430 and may extend to beconnected to the first shielding chip pad 312 of the interface chip 300.The first shielding wire 430E may extend to be located between the firstand second signal extension wires 410E and 420E. The first shieldingwire 430E may be formed to extend in a direction which is substantiallyparallel with the first and second signal extension wires 410E and 420E.In an embodiment, the first shielding wire 430E may be formed to extendin a direction between the first and second signal extension wires 410Eand 420E to mitigate electromagnetic interference between the first andsecond signal extension wires 410E and 420E. In an embodiment, the firstshielding wire 430E may be configured to extend in a direction betweenthe first and second signal extension wires 410E and 420E to shieldelectromagnetic interference between the first and second signalextension wires 410E and 420E. In an embodiment, the first shieldingwire 430E may be formed to extend in a direction between the first andsecond signal extension wires 410E and 420E and along a same profile asat least one of the first and second signal extension wires 410E and420E. The first shielding wire 430E may be disconnected from the packagesubstrate 100 and may extend to be spaced apart from the packagesubstrate 100. The first shielding wire 430E may extend to be directlyconnected to the interface chip 300 without being connected to thepackage substrate 100.

Referring again to FIG. 3, the second interpose wire 450 may connect thesecond interpose die pads 214 included in the first and second sub-stackparts 200U and 200L to each other and may further extend to electricallyconnect the second interpose die pads 214 included in the first andsecond sub-stack parts 200U and 200L to the second interpose chip pad324 of the interface chip 300. The second interpose wire 450 may be usedas another power supply wire for supplying a power supply voltage to thesemiconductor dies 200 included in the first and second sub-stack parts200U and 200L. Alternatively, the second interpose wire 450 may be usedas another ground wire for supplying a ground voltage to thesemiconductor dies 200 included in the first and second sub-stack parts200U and 200L. In some embodiments, the second interpose wire 450 may beused as a ground wire, and the first interpose wire 450 may be used as apower supply wire.

The second shielding wire 450E may be branched from the second interposewire 450 and may extend to be connected to the second shielding chip pad314 of the interface chip 300. The second shielding wire 450E may extendto be located between the second signal extension wire 420E and thefifth signal extension wire 440E. The second shielding wire 450E may beformed to extend in a direction which is substantially parallel with thesecond signal extension wire 420E and the fifth signal extension wire440E.

FIG. 6 is a plan view illustrating the signal extension wires 410E,420E, and 440E and the shielding wires 430E and 450E included in thebonding wire structure of FIG. 3. Some elements less related to thedisposal of the signal extension wires 410E, 420E, and 440E and theshielding wires 430E and 450E will be omitted in FIG. 6 for the purposeof ease and convenience in explanation.

Referring to FIGS. 3 and 6, the first shielding wire 430E may bedisposed between the first and second signal extension wires 410E and420E, and the second shielding wire 450E may be disposed between thesecond signal extension wire 420E and the fifth signal extension wire440E. The first shielding wire 430E may act as a shielding member forshielding electromagnetic interference between the first and secondsignal extension wires 410E and 420E. The first shielding wire 430E maysuppress or reduce signal noises between the first and second signalextension wires 410E and 420E. When signals are transmitted between thefirst sub-stack part 200U and the interface chip 300, the firstshielding wire 430E may provide a solution for reducing the signalnoises.

The second shielding wire 450E may act as a shielding member forshielding electromagnetic interference between the second and fifthsignal extension wires 420E and 440E.

Referring again to FIG. 3, the interface chip 300 may include the firstcolumn of chip pads 310 and the second column of chip pads 320 which areelectrically connected to the die stack 200S and may further include thethird column of chip pads 330. The chip boding wires 460 may be bondedto connect the third column of chip pads 330 to the second bond fingers120 of the package substrate 100. The chip boding wires 460 may beconnection members for electrically connecting the interface chip 300 tothe package substrate 100.

As described above, because chip pads such as the chip pads 310, 320,and 330 are arrayed in a plurality of columns, sufficient spaces betweenthe chip pads may be provided. Thus, it may be possible to preventbonding wires connected to the chip pads from undesirably crossing orcontacting each other.

FIG. 7 is a cross-sectional view illustrating a bonded structure ofwires at a branch position ‘A’ of FIG. 3.

Referring to FIGS. 3 and 7, the first interpose wire 430 may beconfigured to include a first sub-wire 430L connected to a firstinterpose die pad 212A (corresponding to one of the first interpose diepads 212) of a semiconductor die 200A (corresponding to one of thesemiconductor dies 200) located at the branch position ‘A’ and a secondsub-wire 430U bonded to the first sub-wire 430L. First, a first ballportion 430L-B of the first sub-wire 430L may be bonded to the firstinterpose die pad 212A. After the first ball portion 430L-B is bonded tothe first interpose die pad 212A, the first sub-wire 430L may extend tobe connected to the other semiconductor die 200 located under thesemiconductor die 200A.

The semiconductor die 200A located at the branch position ‘A’ may be alowermost die of the semiconductor dies 200 included in the firstsub-stack part 200U. On the lowermost semiconductor die 200A, the firstand second signal extension wires 410E and 420E may extend from thefirst signal wire 410 and the second signal wire 420, respectively. Thefirst shielding wire 430E may also be branched from the lowermostsemiconductor die 200A. The first shielding wire 430E may be branchedfrom the first interpose wire 430 on the lowermost semiconductor die200A of the first sub-stack part 200U. Thus, the first shielding wire430E may be located to be substantially parallel with the first andsecond signal extension wires 410E and 420E, thereby maximizing ashielding effect of the electromagnetic interference between the firstand second signal extension wires 410E and 420E.

As such, after the first sub-wire 430L is formed using a first wirebonding process, the second sub-wire 430U may be bonded to the firstball portion 430L-B using a second wire bonding process. After bonding aball portion (not shown) corresponding to an end portion of the secondsub-wire 430U to the semiconductor die 200 disposed on the lowermostsemiconductor die 200A and extending the second sub-wire 430U, a stitchportion 430U-S of the second sub-wire 430U may be bonded to the firstball portion 430L-B of the first sub-wire 430L to form the secondsub-wire 430U. Thus, a vertical bonding structure may be realized toinclude the first ball portion 430L-B (of the first sub-wire 430L) andthe stitch portion 430U-S (of the second sub-wire 430U) which aresequentially and vertically stacked.

A bonding wire may be formed by a wire boding process such that one endof the bonding wire has a ball-shaped ball portion and the other end ofthe bonding wire has a plate-shaped stitch portion. Because the firstball portion 430L-B of the first sub-wire 430L has a ball shape, it maybe structurally more stable to vertically bond the stitch portion 430U-S(having a plate shape) of the second sub-wire 430U to the first ballportion 430L-B rather than to bond a ball portion (not shown) of thesecond sub-wire 430U to the first ball portion 430L-B.

A second ball portion 430E-B of the first shielding wire 430E may bebonded to the stitch portion 430U-S of the second sub-wire 430U using athird wire bonding process. Thus, the first ball portion 430L-B of thefirst sub-wire 430L, the stitch portion 430U-S of the second sub-wire430U, and the second ball portion 430E-B of the first shielding wire430E may be sequentially and vertically stacked on the first interposedie pad 212A to form a bonding wire branch structure.

FIG. 8 is a cross-sectional view illustrating a semiconductor package 11according to another embodiment.

Referring to FIG. 8, the semiconductor package 11 may be configured toinclude a package substrate 1100 and a die stack 1200S stacked onpackage substrate 1100. The die stack 1200S may be provided bysequentially stacking a plurality of semiconductor dies 1200. Aninterface chip 1300 may be disposed on the package substrate 1100 to bespaced apart from the die stack 1200S. A first bonding wire 1430 may beformed to connect die pads 1210 disposed on the plurality ofsemiconductor dies 1200 to each other and may extend to electricallyconnect the die pads 1210 to a first chip pad 1322 of the interface chip1300. The first bonding wire 1430 may have substantially the sameconfiguration as the first interpose wire 430 illustrated in FIG. 5. Thefirst chip pad 1322 of the interface chip 1300 may indicate the firstinterpose chip pad 322 illustrated in FIG. 5.

A second bonding wire 1430E may be branched from the first bonding wire1430 and may be connected to a second chip pad 1312 of the interfacechip 1300. The second chip pad 1312 of the interface chip 1300 mayindicate the first shielding chip pad 312 illustrated in FIG. 3. Thefirst bonding wire 1430 may indicate the first interpose wire 430illustrated in FIG. 5, and the second bonding wire 1430E may indicatethe first shielding wire 430E illustrated in FIG. 5. Thus, a structurethat the second bonding wire 1430E is branched from the first bondingwire 1430 may be the same as the wire bonding structure at the branchposition ‘A’ illustrated in FIG. 5. The structure that the secondbonding wire 1430E is branched from the first bonding wire 1430 may beformed by vertically bonding the stitch portion 430U-S of the secondsub-wire 430U to the first ball portion 430L-B of the first sub-wire430L and by vertically bonding the second ball portion 430E-B of thefirst shielding wire 430E to the stitch portion 430U-S of the secondsub-wire 430U, as described with reference to FIG. 7.

FIG. 9 is a cross-sectional view illustrating a semiconductor package 20according to yet another embodiment.

Referring to FIG. 9, the semiconductor package 20 may be configured toinclude a package substrate 2100, a first die stack 2200S-1, a seconddie stack 2200S-2, a first interface chip 2300-1, and a second interfacechip 2300-2. The first die stack 2200S-1 may have substantially the sameconfiguration as the die stack 200S described with reference to FIGS. 1to 5. The first interface chip 2300-1 may have substantially the sameconfiguration as the interface chip 300 described with reference toFIGS. 1 to 5. The second die stack 2200S-2 may also have substantiallythe same configuration as the die stack 200S described with reference toFIGS. 1 to 5. The second interface chip 2300-2 may also havesubstantially the same configuration as the interface chip 300 describedwith reference to FIGS. 1 to 5.

The first die stack 2200S-1 may be connected to the first interface chip2300-1 by bonding wires, and the second die stack 2200S-2 may beconnected to the second interface chip 2300-2 by other bonding wires.The second die stack 2200S-2 may be stacked on the first die stack2200S-1. A supporter 2190 may be provided between the package substrate2100 and a portion of the second die stack 2200S-2 to support the seconddie stack 2200S-2.

A boding wire structure having substantially the same configuration asthe boding wire structure illustrated in FIG. 3 may be provided toelectrically connect the first die stack 2200S-1 to the first interfacechip 2300-1. A first interpose wire 2430-1 may be provided to connectthe first die stack 2200S-1 to the first interface chip 2300-1, and afirst shielding wire 2430E-1 may be branched from the first interposewire 2430-1 to be connected to the first interface chip 2300-1.

A boding wire structure having substantially the same configuration asthe boding wire structure illustrated in FIG. 3 may be provided toelectrically connect the second die stack 2200S-2 to the secondinterface chip 2300-2. A second interpose wire 2430-2 may be provided toconnect the second die stack 2200S-2 to the second interface chip2300-2, and a second shielding wire 2430E-2 may be branched from thesecond interpose wire 2430-2 to be connected to the second interfacechip 2300-2.

The first and second interface chips 2300-1 and 2300-2 may independentlycommunicate with the first and second die stacks 2200S-1 and 2200S-2through the bonding wire structure described above. While the first diestack 2200S-1 communicates with the first interface chip 2300-1, thesecond die stack 2200S-2 may communicate with the second interface chip2300-2. Accordingly, an operation speed of the semiconductor package 20may be improved.

FIG. 10 is a block diagram illustrating an electronic system including amemory card 7800 employing at least one of the semiconductor packagesaccording to the embodiments. The memory card 7800 includes a memory7810 such as a nonvolatile memory device, and a memory controller 7820.The memory 7810 and the memory controller 7820 may store data or readout the stored data. At least one of the memory 7810 and the memorycontroller 7820 may include at least one of the semiconductor packagesaccording to the embodiments.

The memory 7810 may include a nonvolatile memory device to which thetechnology of the embodiments of the present disclosure is applied. Thememory controller 7820 may control the memory 7810 such that stored datais read out or data is stored in response to a read/write request from ahost 7830.

FIG. 11 is a block diagram illustrating an electronic system 8710including at least one of the stack packages according to theembodiments. The electronic system 8710 may include a controller 8711,an input/output unit 8712 and a memory 8713. The controller 8711, theinput/output unit 8712 and the memory 8713 may be coupled with oneanother through a bus 8715 providing a path through which data move.

In an embodiment, the controller 8711 may include one or moremicroprocessor, digital signal processor, microcontroller, and/or logicdevice capable of performing the same functions as these components. Thecontroller 8711 or the memory 8713 may include at least one of the stackpackages according to the embodiments of the present disclosure. Theinput/output unit 8712 may include at least one selected among a keypad,a keyboard, a display device, a touchscreen and so forth. The memory8713 is a device for storing data. The memory 8713 may store data and/orcommands to be executed by the controller 8711, and the like.

The memory 8713 may include a volatile memory device such as a DRAMand/or a nonvolatile memory device such as a flash memory. For example,a flash memory may be mounted to an information processing system suchas a mobile terminal or a desktop computer. The flash memory mayconstitute a solid state disk (SSD). In this case, the electronic system8710 may stably store a large amount of data in a flash memory system.

The electronic system 8710 may further include an interface 8714configured to transmit and receive data to and from a communicationnetwork. The interface 8714 may be a wired or wireless type. Forexample, the interface 8714 may include an antenna or a wired orwireless transceiver.

The electronic system 8710 may be realized as a mobile system, apersonal computer, an industrial computer or a logic system performingvarious functions. For example, the mobile system may be any one of apersonal digital assistant (PDA), a portable computer, a tabletcomputer, a mobile phone, a smart phone, a wireless phone, a laptopcomputer, a memory card, a digital music system and an informationtransmission/reception system.

If the electronic system 8710 is an equipment capable of performingwireless communication, the electronic system 8710 may be used in acommunication system using a technique of CDMA (code division multipleaccess), GSM (global system for mobile communications), NADC (northAmerican digital cellular), E-TDMA (enhanced-time division multipleaccess), WCDMA (wideband code division multiple access), CDMA2000, LTE(long term evolution) or Wibro (wireless broadband Internet).

Concepts have been disclosed in conjunction with some embodiments asdescribed above. Those skilled in the art will appreciate that variousmodifications, additions and substitutions are possible, withoutdeparting from the scope and spirit of the present disclosure.Accordingly, the embodiments disclosed in the present specificationshould be considered from not a restrictive standpoint but anillustrative standpoint. The scope of the concepts are not limited tothe above descriptions but defined by the accompanying claims, and allof distinctive features in the equivalent scope should be construed asbeing included in the concepts.

What is claimed is:
 1. A semiconductor package comprising: a packagesubstrate; a die stack configured to include a first sub-stack partstacked on the package substrate and a second sub-stack part disposedbetween the first sub-stack part and the package substrate, wherein eachof the first and second sub-stack parts includes a plurality ofsemiconductor dies and each of the plurality of semiconductor diesincludes a first signal die pad, an interpose die pad, and a secondsignal die pad; an interface chip disposed on the package substrate tobe spaced apart from the die stack; a first signal wire connecting thefirst signal die pads included in the first sub-stack part to eachother; a first signal extension wire extending from the first signalwire to connect the first signal wire to the interface chip; a secondsignal wire connecting the second signal die pads included in the firstsub-stack part to each other; a second signal extension wire extendingfrom the second signal wire to connect the second signal wire to theinterface chip; an interpose wire connecting the interpose die padsincluded in the first and second sub-stack parts to each other andelectrically connecting the interpose die pads included in the first andsecond sub-stack parts to the interface chip; and a shielding wirebranched from the interpose wire to be located between the first andsecond signal extension wires.
 2. The semiconductor package of claim 1,wherein the shielding wire is branched from the interpose wire andextends to be substantially parallel with the first and second signalextension wires.
 3. The semiconductor package of claim 2, wherein theshielding wire is configured to shield an electromagnetic interferencebetween the first and second signal extension wires by extending to besubstantially parallel with the first and second signal extension wires.4. The semiconductor package of claim 1, wherein the first and secondsignal extension wires are configured to transmit data signals, andwherein the shielding wire is configured to supply one of a groundvoltage and a power supply voltage.
 5. The semiconductor package ofclaim 1, wherein the shielding wire is configured to extend in adirection between the first and second signal extension wires and alonga same profile as at least one of the first and second signal extensionwires.
 6. The semiconductor package of claim 1, further comprising: athird signal wire connecting the first signal die pads included in thesecond sub-stack part to each other and extending to electricallyconnect the first signal die pads included in the second sub-stack partto the interface chip; and a fourth signal wire connecting the secondsignal die pads included in the second sub-stack part to each other andextending to electrically connect the second signal die pads included inthe second sub-stack part to the interface chip.
 7. The semiconductorpackage of claim 6, wherein the package substrate includes signal bondfingers disposed between the die stack and the interface chip; andwherein the third and fourth signal wires are bonded to respective onesof the signal bond fingers and are configured to further extend toconnect the signal bond fingers to the interface chip.
 8. Thesemiconductor package of claim 7, wherein the package substrate furtherincludes an interpose bond finger disposed between the die stack and theinterface chip to be spaced apart from the signal bond fingers; andwherein the interpose wire is bonded to the interpose bond finger and isconfigured to further extend to connect the interpose bond finger to theinterface chip.
 9. The semiconductor package of claim 1, wherein theshielding wire is branched from the interpose wire on a lowermostsemiconductor die of the semiconductor dies included in the firstsub-stack part.
 10. The semiconductor package of claim 1, wherein theinterpose wire includes: a first sub-wire, a first ball portion of thefirst sub-wire is bonded to the interpose die pad located at a positionwhere the shielding wire is branched from the interpose wire; and asecond sub-wire, a stitch portion of which is vertically bonded onto thefirst ball portion, wherein the shielding wire includes a second ballportion vertically bonded onto the stitch portion.
 11. The semiconductorpackage of claim 1, wherein the first and second signal extension wiresand the shielding wire extend to be spaced apart from the packagesubstrate and to be connected to the interface chip.
 12. Thesemiconductor package of claim 1, wherein the interpose die pads areprovided as power terminals for applying a power supply voltage to thesemiconductor dies.
 13. The semiconductor package of claim 1, whereinthe interpose die pads are provided as ground terminals for supplying aground voltage to the semiconductor dies.
 14. The semiconductor packageof claim 1, wherein in each of the semiconductor dies, the interpose diepad is disposed between the first signal die pad and the second signaldie pad.
 15. The semiconductor package of claim 1, wherein the interfacechip includes chip pads to which the first and second signal extensionwires, the interpose wire, and the shielding wire are bonded.
 16. Asemiconductor package comprising: a package substrate; a die stackconfigured to include a first sub-stack part stacked on the packagesubstrate and a second sub-stack part disposed between the firstsub-stack part and the package substrate, wherein each of the first andsecond sub-stack parts includes a plurality of semiconductor dies andeach of the plurality of semiconductor dies includes a first signal diepad, an interpose die pad, and a second signal die pad; an interfacechip disposed on the package substrate to be spaced apart from the diestack and configured to include a first column of chip pads and a secondcolumn of chip pads, wherein the first column of chip pads include afirst signal chip pad, a shielding chip pad, and a second signal chippad, and the second column of chip pads include a third signal chip pad,an interpose chip pad, and a fourth signal chip pad; a first signal wireconnecting the first signal die pads included in the first sub-stackpart to each other; a first signal extension wire extending from thefirst signal wire to connect the first signal wire to the first signalchip pad; a second signal wire connecting the second signal die padsincluded in the first sub-stack part to each other; a second signalextension wire extending from the second signal wire to connect thesecond signal wire to the second signal chip pad; an interpose wireconnecting the interpose die pads included in the first and secondsub-stack parts to each other and electrically connecting the interposedie pads included in the first and second sub-stack parts to theinterpose chip pad; a third signal wire connecting the first signal diepads included in the second sub-stack part to each other and extendingto electrically connect the first signal die pads included in the secondsub-stack part to the third signal chip pad; a fourth signal wireconnecting the second signal die pads included in the second sub-stackpart to each other and extending to electrically connect the secondsignal die pads included in the second sub-stack part to the fourthsignal chip pad; and a shielding wire branched from the interpose wireto be located between the first and second signal extension wires. 17.The semiconductor package of claim 16, wherein the interface chipincludes a first edge and a second edge which are opposite to eachother; wherein a distance between the first edge and the die stack isless than a distance between the second edge and the die stack; whereina distance between the first edge and the second column of chip pads isless than a distance between the first edge and the first column of chippads; and wherein the second column of chip pads are arrayed in adirection substantially parallel with the first edge.
 18. Thesemiconductor package of claim 16, wherein the interface chip furtherincludes a third column of chip pads arrayed between the second edge andthe first column of chip pads; and wherein the third column of chip padsare electrically connected to the package substrate through chip bondingwires.
 19. The semiconductor package of claim 16, wherein the packagesubstrate includes signal bond fingers disposed between the die stackand the interface chip; and wherein the third and fourth signal wiresare bonded to respective ones of the signal bond fingers and areconfigured to further extend to connect the signal bond fingers to theinterface chip.
 20. The semiconductor package of claim 19, wherein thepackage substrate further includes an interpose bond finger disposedbetween the die stack and the interface chip to be spaced apart from thesignal bond fingers; and wherein the interpose wire is bonded to theinterpose bond finger and is configured to further extend to connect theinterpose bond finger to the interface chip.
 21. The semiconductorpackage of claim 16, wherein the first and second signal extension wiresand the shielding wire extend to be spaced apart from the packagesubstrate and to be connected to the interface chip.
 22. A semiconductorpackage comprising: a package substrate; a die stack configured toinclude semiconductor dies stacked on the package substrate, whereineach of the semiconductor dies includes a die pad; an interface chipdisposed on the package substrate to be spaced apart from the die stackand configured to include a first chip pad and a second chip pad; afirst bonding wire connecting the die pads of the semiconductor dies toeach other and electrically connecting the die pads to the first chippad of the interface chip; and a second bonding wire branched from thefirst bonding wire and connected to the second chip pad of the interfacechip, wherein the first bonding wire includes: a first sub-wire, a firstball portion of the first sub-wire is bonded to the die pad located at aposition where the second bonding wire is branched from the firstbonding wire; and a second sub-wire, a stitch portion of which isvertically bonded onto the first ball portion, wherein second bondingwire includes a second ball portion vertically bonded onto the stitchportion.
 23. The semiconductor package of claim 22, wherein the secondbonding wire extend to be spaced apart from the package substrate and tobe connected to the second chip pad of the interface chip.
 24. Thesemiconductor package of claim 22, wherein the package substrateincludes a bond finger disposed between the die stack and the interfacechip; and wherein the first bonding wire is bonded to the bond fingerand is configured to further extend to connect the bond finger to thefirst chip pad of the interface chip.